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AP3156
HIGH EFFICIENCY 1X/1.5X/2X CHARGE PUMP
FOR WHITE LED APPLICATIONS
Electrical Characteristics
C IN = C OUT = C 1 = C 2 = 1.0μF; T A = 25°C, V IN = 3.5V. Unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ.
Max
Unit
1X Mode, 3.0 ≤ V IN ≤ 5.5, Active,
No Load Current
0.3
1
I Q
Quiescent Current
1.5X Mode, 3.0 ≤ V IN ≤ 5.5, Active,
No Load Current
2.0
3
mA
2X Mode, 3.0 ≤ V IN ≤ 5.5, Active,
No Load Current
50μA Setting, 1X Mode
1.5
50
3
μA
I SHDN
I DX
I D-Match
Shutdown Current
I SINK Current Accuracy
(Note 4)
Current Matching Between Any
Two Current Sink Inputs
(Note 6)
SDI = 0
I SET = 20mA (Note 5), T A = 25 ° C
I SET = 4mA (Note 5), T A = 25 ° C
V F :
D1:D6 = 3.6V
18.6
3.6
20
4
0.5
1
21.4
4.4
μA
mA
mA
%
1X to 1.5X or 1.5X to 2X
V TH
Transition Threshold at Any
I SET = 25mA
150
mV
I SINK Pin
Charge Pump Section
T SS
Soft-Start Time
40
μs
0.5/
F CLK
Clock Frequency
1/
MHz
2
SDI
V SDI(L)
V SDI(H)
SDI Threshold Low
SDI Threshold High
V IN = 2.7V
V IN = 5.5V
1.4
0.4
V
V
T SLO
T SHI
T OFF
T SEP
I SDI
SDI Low Time
SDI High Time
SDI Off Timeout
SDI Valid Sequence Timeout
SDI Input Leakage
0.3
0.05
-1
50
50
256
256
1
μs
μs
μs
μs
μA
θ JA
Thermal Resistance
Junction-to-Ambient
QFN4040-16 (Note 7)
46
o
C/W
Notes:
4. Determined by the average current levels of all active channels
5. Sequence setting set to give nominal 20mA max output current and 4mA output current.
6. Defined as the deviation of any sink current from the average of all active current channels
7. Device mounted on FR-4 substrate, 2"*2", 2oz, copper, double-sided PC board,
AP3156 Rev. 1
5 of 15
www.diodes.com
SEPTEMBER 2009
? Diodes Incorporated
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